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Method of producing 3-D mold, method of producing finely processed product, method of producing fine-pattern molded product, 3-D Mold, finely processed product, fine-pattern molded product and optical component
Mold microfabrication technology with Silane coupling agent
Field
Nanotechnology, Nano-imprint lithography
Keywords
Nanoimprint technology, Antireflective material, Semiconductor
Advantages
The present invention relates to a method of producing a 3-D mold using an electron beam irradiation drawing technique according to which the 3-D mold can be formed with high precision, a method of producing a finely processed product using the 3-D mold, a method of producing a fine-pattern molded product using the 3-D mold or the finely processed product, the 3-D mold, the finely processed product, the fine-pattern molded product, and an optical element obtained with these production methods.
Abstracts
A 3-D mold in which its depth and line width can be formed with high precision, production methods for a finely machined product and a fine-pattern molded product, a 3-D mold formed with high precision, a finely machined product, a fine-pattern molded product and an optical element. A production method for a 3-D mold capable of controlling a depth to within 10nm and forming a line width to up to 200nm, characterized in than the irradiation step of applying an electron beam to the resist layer of a work having on its substrate the resist layer formed of a polysiloxane material includes the steps of causing no back-scattering and having irradiation conditions requiring the acceleration voltage of 1kV to 3kV and the dosage of up to 400[mu]C/cm<2>; a production method for a finely machined product using a 3-D mold; a production method for a fine-pattern molded product using a 3-D mold or a finely machined product; a 3-D mold formed with high precision by these production methods; a finely machined product; a fine-pattern molded product and an optical element.
Inventors
Associate Prof. Jun Taniguchi
Patent information
(APPLICATION NUMBER, FILING DATE)JP2006-044588（Feb. 21, 2006）, WO2006303084 (Feb. 21, 2006), EP06714224.0（Feb. 21, 2006）, US11/816773 (Feb. 21, 2006)
(PUBLICATION NUMBER, PUBLICATION DATE)JP2007-156384（Jun. 21, 2007）, WO2006/088209（Aug. 24, 2006）, EP1852236、US2009/0026583 (Jan. 29, 2009
Internal file number
G2005-008, T2005-107 (T2004-086, T2005-072)
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